Multilayer printed circuit board manufacturing in China

We specialize in the integrated production of multilayer printed circuit boards for Russian corporate customers.
Number of layers

up to 40 layers

Hole size

0.08mm

Line width and spacing

2mil/2mil

HDI extension

4+N+4

Low CTE

14-18 ppm/°C

Многослойная печатная плата HDI
A multilayer HDI (High-density interconnect) PCB is a PCB that has a much higher connectivity density than a conventional through-hole PCB. According to IPC-6012 (1.4.1), this is defined as a design in which the average number of electrical connections per cm2 is 20 or more on both sides of the PCB.

HDI printed circuit boards have one or more of the following characteristics:

The tight tolerances involved in working with HDI multilayer PCBs mean you need to partner with an experienced supplier, and as a leading supplier of HDI multilayer PCBs, YPCB can supply high quality boards that have significantly higher circuit density than your traditional PCBs.

Special Techniques

Обратное Сверление

Back Drilling

Back drilling is a process of creating vias by removing a stub in multilayer printed circuit boards, allowing signals to be transferred from one board layer to another, which is a special way to control the drilling depth.
Контроль Импеданса

Impedance Control

Control the impedance value of the conductor on the high-speed printed circuit board within a certain range according to the data transmission requirements.

Через В Блокноте

Via In Notepad

Through Hole in Pad is a process that is widely used to implement high-density interconnect technology. It refers to plated holes and can be simply understood as a viable hole in a BGA pad.

HDI Multilayer Printed Circuit Board Costs

The cost of HDI multilayer PCBs depends on many factors. Consider the following to help you set your budget and ensure maximum cost effectiveness when ordering your PCB:

The type, microvias, or vias you choose for your HDI PCB will affect its cost, as will the number of these elements you need. Smaller vias are more expensive than larger ones due to the higher precision required. Of course, increasing the number of vias can also increase the price.

The type of stackup you need will also affect the cost. A high-density 2+N+2 layout is more complex than a 1+N+1, so it will be more expensive. The extra layers add to the cost. You should aim for the most cost-effective and efficient layer count.

You may have several material options for your board. Base materials may be FR4, metal, fiberglass, or others depending on the application. For surface finishes, you can choose between ENIG, HASL, copper, silver bath, gold, and others. ENIG is the most common for HDI due to its flatness and solderability.

The number of layers and the types of Via structures determine the number of successive laminations required. Although more laminations mean more processing time and higher costs, adding them can improve product performance and cost effectiveness.

There may also be cost differences between stacked and dual configurations. Stacked vias can be filled with copper, but dual microvias cannot. Filling the vias means more material and time required to complete the project.

You should aim to determine the site size in advance to help reduce costs. Knowing the correct site size will help you plan your design effectively and cost-effectively.

If you request an expedited PCB, you may incur additional costs due to the additional resources required to fulfill the rush order. Sometimes unexpected situations that get out of control are unavoidable, but planning orders in advance can increase cost efficiency. YPCB offers fast turnaround times and responsive customer service.

The partners you choose to work with also have a significant impact on the cost of your HDI PCB. You want to choose a supplier with competitive pricing that can also efficiently deliver high-quality products to ensure cost effectiveness. It is better to order a high-quality product once than to have to deal with repairs or replacements after the order.

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