Flexible Printed Circuit Boards and Rigid-Flexible Printed Circuit Boards
Number of layers
up to 18 layers
Hole size
3mil
Line width and spacing
2mil/2mil
Flexible printed circuit boards
Flexibility: The most obvious feature is that the flexible PCB material is flexible, allowing it to bend and flex without breaking, making it an ideal choice for applications that require movement or maneuverability.
Thin and Lightweight: Flexible PCBs are thinner and lighter than rigid PCBs, making them suitable for applications that require portability and compactness.
High Density: Flexible printed circuit boards can be designed to accommodate a high density of electrical components, allowing the board size to be minimized while maintaining functionality.
Cost Effective: Since flexible PCBs are manufactured using a roll-to-roll process, this reduces waste, making them more cost effective than rigid PCBs.
Increased Durability: Rigid-flex PCBs are less prone to wear and tear and are better able to withstand bending or flexing than conventional PCBs.
Space Efficient Design: Flexible rigid PCBs allow high density packaging, saving space compared to conventional PCBs.
Multiple PCB Integration: Allows the integration of two or more PCBs into a single complex board.
Customizability: Rigid-flex PCBs are highly customizable and can be designed to meet specific requirements.
Flexible Rigid Printed Circuit Boards
Production Capabilities
| Items | Parameters |
|---|---|
| Material | PI, PET, HANDLE, FR-4, DuPont |
| Number of layers | Standard Flexible Chains: 1-12 Standard Rigid-Flexible Chains: 1-18 |
| Flammability | UL 94V-0 |
| Quality standards | IPC Classes 2/3 |
| Maximum board size | 508×580 mm |
| Finish thickness | Flexible plate: 0.15–0.63 mm. Rigid-flexible plate: 0.06–4.0 mm. |
| Thickness of copper | 1/3-2 oz |
| Stiffening material | Polyimide/FR4/Metal |
| Cover Film | Black yellow |
| Solder mask dam | 4 mil |
| Surface finishing | ENIG, Gold Fingers, ENEPIG, Electrolytic Wire, Gold, OSP, IAG, ISn, etc. |
| Coating thickness | Immersion Nickel/Gold: Nickel: 100u"-200u" Gold: 1u"-5u" Gold Plated: Nickel: 100u"-200u" Gold: 1u"-4u" Immersion Silver: 6u"-12u" OSP: Film 8u"- 20u" |
| Minimum hole size | 3 mil |
| Minimum trace width/interval | 2mil/2mil |
| Minimum solder mask clearance | 3 mil |
| Minimum annular ring | 4 mil |
| Board thickness tolerance | ±5% |
| Hole diameter tolerance | ±2 mil |
| Hole location tolerance | ±4 mil |
| Tolerance contour | ±3 mil |
| Aspect ratio | 0.25 |
| Quality test | AOI, 100% electronic test |
| Value Added Services | DFM verification, accelerated production |
| Data formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc. |
Problems Associated with Flexible Printed Circuits
Flexible radius and flexibility
Achieving the desired bend radius and flexibility without compromising the structural integrity of the PCB.
Our engineers carefully design the PCB layout, taking into account the material properties and the required flexibility. We use advanced materials and precision manufacturing techniques to ensure optimum flexibility without compromising strength.
Selection of materials
Selection of suitable materials that can withstand bending, flexing and specific environmental conditions of the application.
We work with various flexible and flex-rigid materials, carefully selecting those that have high flexural strength and reliability. Our deep expertise in materials ensures their compatibility with various applications, including those in harsh operating conditions.
Maintaining the integrity of copper traces
Maintains the integrity of copper traces during bending, preventing cracks or damage that may affect electrical performance.
Our manufacturing process includes precision copper deposition and reinforcement techniques. We use innovative technologies to strengthen the copper traces, ensuring a reliable electrical connection even under constant bending.
Layer alignment in rigid-flex printed circuit boards
Ensuring proper layer alignment in rigid-flex printed circuit boards, especially in complex designs.
We use advanced lamination and bonding techniques to achieve precise layer alignment in rigid-flex PCBs. Our engineering team performs rigorous testing to ensure accurate layer placement and reliability of the final product.
Thermal management
Efficient heat dissipation management in flexible and rigid-flex printed circuit boards.
Our thermal management solutions include the use of high thermal conductivity materials and strategic component placement. We optimize designs to improve heat dissipation, preventing problems associated with overheating in demanding applications.
Reliability testing
Ensuring reliability and durability of flexible and rigid-flex printed circuit boards under a variety of operating conditions.
We conduct rigorous testing protocols, including bending testing, thermal cycling testing, and accelerated aging testing. These exhaustive tests ensure that our PCBs meet and exceed industry standards for reliability and performance.
Get your PCB into production today
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