Manufacturing Processes
Every year, YPCB invests a lot of effort and resources into upgrading equipment and technological processes in order to improve its technical qualifications and reduce customer costs.
Manufacturing and assembly of printed circuit board
Printed circuit board manufacturing technology and equipment optimized for the communication, medical and industrial control industries, including antenna board technology, WIFI simulated test environment, etc.
DFM/DFA Check
Once a turnkey order is handed over to YPCB’s manufacturing team, their first priority is to verify the design through a thorough DFM/DFA review process. These reviews include checking for consistency, part spacing, packaging accuracy, and clear orientation markings in the various design documents (files provided by you, BoM, Gerber, centroid, etc.). We will be in close contact with you during this stage to prevent any downtime.
Printed circuit board manufacturing
After the DFM/DFA verification is completed, the order will proceed to the PCB manufacturing stage. Here, according to the design requirements, the PCB is formed through several stages of material lamination, drilling, copper deposition/etching, and electrical testing to ensure that the PCB is 100% in line with the design requirements.
Incoming Quality Control (IQC)
YPCB’s parts procurement team will begin working simultaneously to ensure that all assembly materials are received and ready for use as soon as the PCB is completed. Our Incoming Quality Control (IQC) team conducts thorough checks, including sample testing and date code checking, before any specific material or component is placed in the warehouse. Our advanced software management system and constant temperature and humidity warehouse ensure that parts are always in good working condition.
SMT solder paste printing
The first step in the PCB assembly process is to apply solder paste to the exposed board. Here, an SMT stencil and solder paste printer will be used to accurately distribute the solder paste onto the PCB pads. For double-sided and multi-layer PCBs, this process must be performed separately for each side. The solder chosen by YPCB is a lead-free alloy containing 96.5% tin, 3% silver and 0.5% copper, compliant with RoHS, REACH and JEIDA directives. We use automatic SPI to ensure accurate solder paste printing.
Automatic placement
After applying solder paste to the exposed PCB, components are mounted on their respective pads, with 100% automated part placement for maximum accuracy and efficiency. YPCB and uses the design’s center of mass file to obtain part coordinates and rotation data. Use AOI to inspect the board after component placement to ensure all locations are accurate.
Reflow soldering
The most common PCB assembly method in the industry today, YPCB allows for reflow soldering of most components on the board, and then passes most of the assembled board on to the next process. For double-sided and multi-layer PCBs, each side of the PCB must be reflowed separately.
X-ray examination
After the reflow cycle, any board containing a BGA, QFN, or other lead-free packaging type is sent for x-ray inspection. Not only can x-ray inspection detect problems with the PCB assembly, but analyzing the x-ray images can also help identify the root cause of a given defect, such as insufficient solder paste, skewed part placement, or improper reflow profile.
Wave soldering
YPCB uses wave soldering to solder individual components, sending the board on a conveyor belt through a “wave” of molten solder that bonds the exposed component pads and pins together before cooling and solidifying. While we encourage customers to design using reflow soldering as much as possible, wave soldering is often still the most efficient PCB assembly method for boards containing large connectors with very high pin counts.
final test
In order to fully guarantee the highest manufacturing quality, YPCB always conducts a thorough final inspection of the fully finished PCBs at the end of the processing process, including visual inspection, automatic optical inspection (AOI), functional circuit testing (FCT) and online testing (ICT). ICT and FCT include a variety of testing methods, depending on the specific requirements of a particular project.
Engineering Support
For many customers who are not in engineering positions, PCB manufacturing is a mystery. To simplify your process, YPCB provides you with engineering support from A to Z. We have a team of respected engineers who can provide unique insight into your challenges.
- Provide panel suggestions or configuration files
- More than 200 design manufacturability checks
- Full file editing capabilities
- Compatible with all widely used PCB design software and provides format conversion.
- Support for HPGL files
- Chip recording service